Effect of Modification on Electrochemical Chelation of Polyimide Films

Saule Kudaikulova1, Assima Syzdykova1, Rinat Iskakov1 and Bulat Zhubanov1, Juldyz Akhmetova2, Olga Moisseyevich2, Andrey Kurbatov2, Tleuken Akhmetov2 and Marc J.M. Abadie3

1Insitute of Chemical Sciences, 106 Walikhanov st., 480100, Almaty, Kazakhstan

2Center of Physico-Chemical Analysis, al-Farabi National University

95a Karasay Batyr st., 480012, Almaty, Kazakhstan

3Laboratory of Polymer Science & Advance Organic Materials, Montpellier University 2,

S.T.L., Place Eugène Bataillon, 34095 Montpellier Cedex 5, France


Novel procedure of electrochemical chelation of polyimide films was developed. The kinetics of silver cation sorptions into the films during the chelation was found out. The effect of modification treatment of film surfaces on kinetics of electrochemical process was studied. The stabilization of ion-sorbed layer of films occurs in water-isopropanol solvents. Sorption of silver during electrochemical deposition is 0.75-1.5 mg per 100 mm of polyimide depending on modification solution. Thus, the most appropriate morphological modification with about 1.5 mg/100 mm take places in heterocyclic solvents. The resulting metallized polyimide films show good non-washing out adhesion of metal into gel-like structured surfacial layers of the film.